This event format has been established in Germany for over 10 years. It brings together users, manufacturers, integrators, and newcomers to the IO-Link community. The content is continuously adapted to reflect the ongoing development of IO-Link.

This year’s IO-Link Forum took place in Wiesloch on October 21 and impressed attendees with a varied program, many interesting discussions, and an all-around successful atmosphere. With around 80 participants, the event was well attended. The forum offered an excellent opportunity to exchange ideas on current developments and new applications related to IO-Link, gain new insights, and nurture existing contacts.

A particular highlight was a series of new presentations that offered exciting insights and fresh perspectives on unusual applications and practical uses of IO-Link. 

The accompanying Microfair was also a resounding success. In the bright venue, 22 exhibitors showcased their offerings, providing visitors with a wide range of opportunities to learn about innovative solutions, discuss questions directly with experts, and make new contacts. The numerous high-quality and interesting discussions demonstrated once again how important personal interaction is within the IO-Link community.

Our conclusion: An all-around successful IO-Link Forum featuring interesting content, valuable connections, and a unique atmosphere. A heartfelt thank you to all the speakers, exhibitors, and participants who made this event such a special experience.

We’re already looking forward to the next IO-Link Forum on May 4 in Augsburg!