What is IO-Link?

IO-Link is the first globally standardized IO technology (IEC 61131-9) for communicating with sensors and actuators. The powerful point-to-point communication is based on the long-established 3-wire sensor and actuator connection without any additional requirements for the cable material. IO-Link is therefore not a fieldbus, but the evolutionary further development of the previous, tried and tested connection technology for sensors and actuators.

 

19 Oct
19 Oct
IO-Link Interop 2027 – For the First Time in Stuttgart!

Do you have new IO-Link products and would like to test them in advance?

On October 19–20, 2027, the annual IO-Link Interop Workshop will take place for the first time in Stuttgart, Germany, at the Mövenpick Hotel Stuttgart Messe & Congress.

International manufacturers of IO-Link devices, tools and integration components will come together to test and ensure seamless interoperability in OT and connectivity to IT.

In addition to standard IO-Link technology, the workshop will cover profile implementations, system integration and IoT connectivity via interfaces such as the JSON REST API. A particular highlight is the opportunity to test IO-Link Safety devices!

The IO-Link Plugfest provides an ideal opportunity to test the interoperability of your devices and software in a realistic environment, ensuring seamless interaction with products from other manufacturers. You can identify potential issues early in the development process, exchange technical knowledge and clarify open questions directly with experts. Depending on your development progress, you may also have the opportunity to perform test runs using one of the available testers.

Our IO-Link experts will be available throughout the workshop to answer your questions. Direct exchange with fellow developers and manufacturers offers valuable insights, practical feedback and opportunities to further improve your products and solutions.

Participation Fee
The participation fee is €290 per participant, including food, beverages and a joint dinner in the evening. Accommodation is not included.

Venue & Date
October 19–20, 2027
Mövenpick Hotel Stuttgart Messe & Congress
Stuttgart, Germany

Registration
Online registration details and the registration deadline will be announced in due course.

Current News
IO-Link Forum in Wiesloch, Germany.
Successful IO-Link Forum in Wiesloch (Germany): Engaging Presentations and Valuable Discussions

This event format has been established in Germany for over 10 years. It brings together users, manufacturers, integrators, and newcomers to the IO-Link community. The content is continuously adapted to reflect the ongoing development of IO-Link.

This year’s IO-Link Forum took place in Wiesloch on October 21 and impressed attendees with a varied program, many interesting discussions, and an all-around successful atmosphere. With around 80 participants, the event was well attended. The forum offered an excellent opportunity to exchange ideas on current developments and new applications related to IO-Link, gain new insights, and nurture existing contacts.

A particular highlight was a series of new presentations that offered exciting insights and fresh perspectives on unusual applications and practical uses of IO-Link. 

The accompanying Microfair was also a resounding success. In the bright venue, 22 exhibitors showcased their offerings, providing visitors with a wide range of opportunities to learn about innovative solutions, discuss questions directly with experts, and make new contacts. The numerous high-quality and interesting discussions demonstrated once again how important personal interaction is within the IO-Link community.

Our conclusion: An all-around successful IO-Link Forum featuring interesting content, valuable connections, and a unique atmosphere. A heartfelt thank you to all the speakers, exhibitors, and participants who made this event such a special experience.

We’re already looking forward to the next IO-Link Forum on May 4 in Augsburg! 

The IO-Link experts were on hand at the Interop Workshop for direct technical exchange.
Interoperability Put to the Test: International IO-Link Community Meets in Bad Soden

Real-world testing reveals how well standards work when devices from different manufacturers are expected to interact seamlessly. That was precisely the focus of the IO-Link Interop Workshop 2026, which took place on September 22 and 23 in Bad Soden (Germany). With 115 participants from China, Germany, Ireland, Italy, the Netherlands, Poland, Switzerland, the Czech Republic, and Hungary, developers, manufacturers, and IO-Link experts from a total of nine countries came together.

The focus was on cross-vendor interoperability testing. Participants had the opportunity to test their devices, systems, and developments with solutions from other manufacturers, discuss technical questions directly, and identify potential improvements. In addition to the basic IO-Link technology, topics such as IO-Link Safety, profile implementations, system integration, IoT connections via the JSON-REST API, and IO-Link Wireless were also examined.

The topic of interoperability was also vividly illustrated in an IO-Link showcase featuring a Carrera racetrack. There, participants saw how different devices and components work together in a shared application. The showcase thus clearly demonstrated what interoperability is all about: reliable communication and the interaction of components from different manufacturers.

Direct interaction with the IO-Link experts was also of great importance. The staff and leaders of the IO-Link working groups were easily recognizable by their special T-shirts and could be approached directly by participants with technical questions. This led to numerous discussions on specific issues related to development and application.

In addition, the workshop provided an opportunity to discuss future requirements and issues related to IO-Link. On the second day of the event, the IO-Link experts discussed selected topics with the participants in small groups. Practical experience and requirements from developers and users provide the IO-Link Working Groups with valuable input for their ongoing technical work.
 

IO-Link User Workshop Hungary 2026 – Budapest

The 8th IO-Link User Workshop Hungary will take place in Budapest on 15 October 2026, bringing together automation professionals, machine builders, system integrators, end users, and technology providers for a full day dedicated to the latest developments in IO-Link technology.

The primary goal of the IO-Link User Workshop is to provide industrial professionals with practical insights into the capabilities and benefits of IO-Link. During the event, participants will gain a deeper understanding of IO-Link communication, explore the latest developments of the protocol, and learn how IO-Link is supporting the digital transformation of modern manufacturing.

This year’s program will feature international experts from the IO-Link Steering Committee, who will present the latest trends, innovations, and future directions of the technology. Attendees will also have the opportunity to learn from real-world application examples presented by leading manufacturers, showcasing the services, functionalities, and advantages of their latest IO-Link-enabled products and solutions.

Throughout the conference, experienced IO-Link specialists will demonstrate how the technology simplifies the configuration, monitoring, maintenance, and replacement of industrial sensors and actuators. Through practical case studies and implementation examples, participants will gain valuable insights into the engineering, commissioning, and operation of IO-Link-based systems. The presentations will also compare conventional automation approaches with IO-Link solutions, highlighting both the technical and economic benefits of adopting IO-Link technology.

A special highlight of the 2026 event will be a roundtable discussion featuring members of the IO-Link Steering Committee. During this session, internationally recognized experts will exchange views on current industry challenges, future opportunities, and the evolving role of IO-Link in smart manufacturing and industrial digitalization. This discussion will provide attendees with a unique opportunity to gain insights directly from the experts helping to shape the future of IO-Link.

The conference presentations will be delivered in Hungarian, making the technical content easily accessible to local attendees. The roundtable discussion will be conducted in English, allowing participants to hear directly from the international Steering Committee members. To ensure that all participants can fully benefit from the discussion, Hungarian translation will be provided during the roundtable session. Attendees will also have the opportunity to interact and network with international experts and exhibitors in English throughout the event.

Alongside the presentations, visitors will have the opportunity to explore an all-day mini exhibition, where leading manufacturers will showcase their latest devices, products, and solutions. Attendees are encouraged to discuss technical questions directly with exhibitors during breaks or throughout the day, creating valuable opportunities for networking and knowledge exchange.

The event is free to attend, but registration is mandatory. Reserve your place today and join the IO-Link community in Budapest on 15 October 2026.

 

Please register here