IO-Link Explained: The Powerful Communication Standard

IO-Link Safety extends the established IO-Link technology to include functional safety and enables secure communication between safety-related sensors, actuators, and the higher-level safety control system. This allows safety functions - such as monitoring safety doors, controlling safe actuators, light curtains, or emergency stop devices - to be integrated flexibly and consistently into machines and systems.

IO-Link Safety technology is based on IO-Link and brings its well-known advantages to the world of functional safety. The focus is on the simplified integration of safety-related devices, integration via the IODD device description file, and easy device replacement. In combination with IO-Link, IO-Link Safety opens up new possibilities for efficient, cost-effective, and future-proof machine automation.

The combination of the two technologies - IO-Link and IO-Link Safety - enables a holistic communication concept and supports machine and plant manufacturers in implementing functional safety as an integral part of their automation solution.

With the first devices certified by TÜV SÜD, an important milestone has now been reached. This creates the essential prerequisites for practical application, IO-Link Safety can now take the next step toward market penetration.

At the SPS 2026 trade show in Nuremberg, the IO-Link Community will present an exhibit in Hall 5, Booth 210, that brings together IO-Link and IO-Link Safety. The demonstration shows how different devices interact in the field of functional safety using a scaled-down robotic application with an operator and signaling unit as well as safety door monitoring. It illustrates how IO-Link Safety can be used in mechanical engineering in the future.

For the first time, devices with TÜV SÜD certification are being used. These include a light curtain, a modular door interlock, an IO-Link Safety Master, and two different RFID switches.
 

This event format has been established in Germany for over 10 years. It brings together users, manufacturers, integrators, and newcomers to the IO-Link community. The content is continuously adapted to reflect the ongoing development of IO-Link.

This year’s IO-Link Forum took place in Wiesloch on October 21 and impressed attendees with a varied program, many interesting discussions, and an all-around successful atmosphere. With around 80 participants, the event was well attended. The forum offered an excellent opportunity to exchange ideas on current developments and new applications related to IO-Link, gain new insights, and nurture existing contacts.

A particular highlight was a series of new presentations that offered exciting insights and fresh perspectives on unusual applications and practical uses of IO-Link. 

The accompanying Microfair was also a resounding success. In the bright venue, 22 exhibitors showcased their offerings, providing visitors with a wide range of opportunities to learn about innovative solutions, discuss questions directly with experts, and make new contacts. The numerous high-quality and interesting discussions demonstrated once again how important personal interaction is within the IO-Link community.

Our conclusion: An all-around successful IO-Link Forum featuring interesting content, valuable connections, and a unique atmosphere. A heartfelt thank you to all the speakers, exhibitors, and participants who made this event such a special experience.

We’re already looking forward to the next IO-Link Forum on May 4 in Augsburg! 

Real-world testing reveals how well standards work when devices from different manufacturers are expected to interact seamlessly. That was precisely the focus of the IO-Link Interop Workshop 2026, which took place on September 22 and 23 in Bad Soden (Germany). With 115 participants from China, Germany, Ireland, Italy, the Netherlands, Poland, Switzerland, the Czech Republic, and Hungary, developers, manufacturers, and IO-Link experts from a total of nine countries came together.

The focus was on cross-vendor interoperability testing. Participants had the opportunity to test their devices, systems, and developments with solutions from other manufacturers, discuss technical questions directly, and identify potential improvements. In addition to the basic IO-Link technology, topics such as IO-Link Safety, profile implementations, system integration, IoT connections via the JSON-REST API, and IO-Link Wireless were also examined.

The topic of interoperability was also vividly illustrated in an IO-Link showcase featuring a Carrera racetrack. There, participants saw how different devices and components work together in a shared application. The showcase thus clearly demonstrated what interoperability is all about: reliable communication and the interaction of components from different manufacturers.

Direct interaction with the IO-Link experts was also of great importance. The staff and leaders of the IO-Link working groups were easily recognizable by their special T-shirts and could be approached directly by participants with technical questions. This led to numerous discussions on specific issues related to development and application.

In addition, the workshop provided an opportunity to discuss future requirements and issues related to IO-Link. On the second day of the event, the IO-Link experts discussed selected topics with the participants in small groups. Practical experience and requirements from developers and users provide the IO-Link Working Groups with valuable input for their ongoing technical work.