What is IO-Link?

IO-Link is the first globally standardized IO technology (IEC 61131-9) for communicating with sensors and actuators. The powerful point-to-point communication is based on the long-established 3-wire sensor and actuator connection without any additional requirements for the cable material. IO-Link is therefore not a fieldbus, but the evolutionary further development of the previous, tried and tested connection technology for sensors and actuators.

 

19 Oct
19 Oct
IO-Link Interop 2027 – For the First Time in Stuttgart!

Do you have new IO-Link products and would like to test them in advance?

On October 19–20, 2027, the annual IO-Link Interop Workshop will take place for the first time in Stuttgart, Germany, at the Mövenpick Hotel Stuttgart Messe & Congress.

International manufacturers of IO-Link devices, tools and integration components will come together to test and ensure seamless interoperability in OT and connectivity to IT.

In addition to standard IO-Link technology, the workshop will cover profile implementations, system integration and IoT connectivity via interfaces such as the JSON REST API. A particular highlight is the opportunity to test IO-Link Safety devices!

The IO-Link Plugfest provides an ideal opportunity to test the interoperability of your devices and software in a realistic environment, ensuring seamless interaction with products from other manufacturers. You can identify potential issues early in the development process, exchange technical knowledge and clarify open questions directly with experts. Depending on your development progress, you may also have the opportunity to perform test runs using one of the available testers.

Our IO-Link experts will be available throughout the workshop to answer your questions. Direct exchange with fellow developers and manufacturers offers valuable insights, practical feedback and opportunities to further improve your products and solutions.

Participation Fee
The participation fee is €290 per participant, including food, beverages and a joint dinner in the evening. Accommodation is not included.

Venue & Date
October 19–20, 2027
Mövenpick Hotel Stuttgart Messe & Congress
Stuttgart, Germany

Registration
Online registration details and the registration deadline will be announced in due course.

Current News
IO-Link Interop Workshop 2025 in Bad Soden: Record attendance and focus on IO-Link Safety

On September 23–24, 2025, another IO-Link Plugfest took place in Bad Soden. With almost 125 participants, the event was completely booked out. Around 60 different companies from all over the world took the opportunity to test their IO-Link products on site in a practical environment.

International interest was particularly high this year, with representatives from countries such as Hungary, Luxembourg, Switzerland, Poland, China, Denmark, Great Britain, the USA, the Netherlands, and the Czech Republic traveling to the Plugfest. During the Interop Workshop, a new test system for masters and devices was successfully audited by a Chinese test center and then immediately tested in use by numerous participating device manufacturers.

In addition to standard IO-Link technology, the focus was also on new topics such as IO-Link Wireless, profile implementations, system integrations, and IoT connections via JSON REST API. A particular highlight was the presentation and testing of the IO-Link Safety Demo—with new functions and additional devices from various manufacturers—an important step in the further development of the technology.

Besides the technical tests, networking was also a focal point: the intensive exchange between developers, manufacturers, and IO-Link experts provided valuable impetus and inspiration for future projects. Many participants took the opportunity to make new contacts, deepen existing partnerships, and share practical experiences with each other.

The workshop offered participating companies the chance to test their devices and software solutions for interoperability and ensure that they work seamlessly with products from other manufacturers. Test runs during the development phase provided important insights and clarified open questions in direct exchange with international IO-Link experts.

“The strong response and the large number of new products clearly show that IO-Link plays a central role in industrial communication worldwide,” summarized Frank Moritz, working group leader for IO-Link Quality & Technology. 

It is already clear today that the success story will continue – the next IO-Link Interop Workshop is scheduled for fall 2026 and will once again provide an opportunity for comprehensive testing, intensive exchange of experience, and the continuation of technological development.